View 74LVCH245APW_1202725.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

INTEGRATED CIRCUITS
DATA SHEET
74LVC245A; 74LVCH245A Octal bus transceiver with direction pin with 5 V tolerant input/outputs (3-state)
Product specification Supersedes data of 2002 Jun 20 2003 May 07
Philips Semiconductors
Product specification
Octal bus transceiver with direction pin with 5 V tolerant input/outputs (3-state)
FEATURES * 5 V tolerant inputs/outputs for interfacing with 5 V logic * Wide supply voltage range from 1.2 to 3.6 V * CMOS low power consumption * Direct interface with TTL levels * Inputs accept voltages up to 5.5 V * High-impedance when VCC = 0 V * bus-hold on all data inputs (74LVCH245A only) * Complies with JEDEC standard no. 8-1A * ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V * Specified from -40 to +85 C and -40 to +125 C. QUICK REFERENCE DATA GND = 0 V; Tamb = 25 C; tr = tf 2.5 ns. SYMBOL tPHL/tPLH CI CI/O CPD Notes 1. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi x N + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; N = total load switching outputs; (CL x VCC2 x fo) = sum of the outputs. 2. The condition is VI = GND to VCC. PARAMETER propagation delay An to Bn, Bn to An input capacitance input/output capacitance power dissipation capacitance per buffer VCC = 3.3 V; notes 1 and 2 CONDITIONS CL = 50 pF; VCC = 3.3 V DESCRIPTION
74LVC245A; 74LVCH245A
The 74LVC245A/74LVCH245A is a high-performance, low-power, low-voltage, Si-gate CMOS device, superior to most advanced CMOS compatible TTL families. Inputs can be driven from either 3.3 or 5 V devices. In 3-state operation outputs can handle 5 V. These features allow the use of these devices as translators in a mixed 3.3 and 5 V environment. The 74LVC245A/74LVCH245A is an octal transceiver with non-inverting 3-state bus compatible outputs in both send and receive directions. The 74LVC245A/74LVCH245A has an output enable (OE) input for easy cascading and a send/receive (DIR) input for direction control. OE controls the outputs so that the buses are effectively isolated.
TYPICAL 2.9 4.0 10.0 15 ns pF pF pF
UNIT
2003 May 07
2
Philips Semiconductors
Product specification
Octal bus transceiver with direction pin with 5 V tolerant input/outputs (3-state)
ORDERING INFORMATION PACKAGE TYPE NUMBER 74LVC245AD 74LVCH245AD 74LVC245ADB 74LVCH245ADB 74LVC245APW 74LVCH245APW 74LVC245ABQ 74LVCH245ABQ FUNCTION TABLE See note 1. INPUT OE L L H Note 1. H = HIGH voltage level; L = LOW voltage level; X = don't care; Z = high-impedance OFF-state. PINNING PIN 1 2 3 4 5 6 7 8 9 10 SYMBOL DIR A0 A1 A2 A3 A4 A5 A6 A7 GND DESCRIPTION direction control input data input/output data input/output data input/output data input/output data input/output data input/output data input/output data input/output ground (0 V) 20 VCC PIN 11 12 13 14 15 16 17 18 19 SYMBOL B7 B6 B5 B4 B3 B2 B1 B0 OE DIR L H X An A=B input Z TEMPERATURE RANGE PINS -40 to +125 C -40 to +125 C -40 to +125 C -40 to +125 C -40 to +125 C -40 to +125 C -40 to +125 C -40 to +125 C 20 20 20 20 20 20 20 20 PACKAGE SO20 SO20 SSOP20 SSOP20 TSSOP20 TSSOP20 DHVQFN20 DHVQFN20
74LVC245A; 74LVCH245A
MATERIAL plastic plastic plastic plastic plastic plastic plastic plastic
CODE SOT163-1 SOT163-1 SOT339-1 SOT339-1 SOT360-1 SOT360-1 SOT764-1 SOT764-1
INPUT/OUTPUT Bn input B=A Z
DESCRIPTION data input/output data input/output data input/output data input/output data input/output data input/output data input/output data input/output output enable input (active LOW) supply voltage
2003 May 07
3
Philips Semiconductors
Product specification
Octal bus transceiver with direction pin with 5 V tolerant input/outputs (3-state)
74LVC245A; 74LVCH245A
handbook, halfpage
DIR 1
VCC 20 19 18 17 16 OE B0 B1 B2 B3 B4 B5 B6
handbook, halfpage
DIR 1 A0 2 A1 3 A2 4 A3 5 A4 6 A5 7 A6 8 A7 9 GND 10
MNA173
20 VCC 19 OE 18 B0 17 B1 16 B2
A0 A1 A2 A3 A4 A5 A6 A7
2 3 4 5
245
15 B3 14 B4 13 B5 12 B6 11 B7
GND*
6 7 8 9 10 GND 11 B7
MCE182
15 14 13 12
* The die substrate is attached to this pad using conductive die attach material. It can not be used as a supply pin or input.
Fig.1 Pin configuration SO20 and (T)SSOP20.
Fig.2 Pin configuration DHVQFN20.
2003 May 07
4
Philips Semiconductors
Product specification
Octal bus transceiver with direction pin with 5 V tolerant input/outputs (3-state)
74LVC245A; 74LVCH245A
handbook, halfpage
1
DIR OE
19
2
handbook, halfpage
A0 B0 18
19 1
G3 3EN1 3EN2 3 A1
B1 4 A2 B2 A3 5 B3 6 A4 B4 7 A5 B5 8 A6 B6 9 A7 B7
17
1 2 3 4 5 6 7 8 9
MNA175
2
18 17 16 15 14 13 12 11
16
15
14
13
12
11
MNA174
Fig.3 Logic symbol (IEEE/IEC).
Fig.4 Logic symbol.
2003 May 07
5
Philips Semiconductors
Product specification
Octal bus transceiver with direction pin with 5 V tolerant input/outputs (3-state)
RECOMMENDED OPERATING CONDITIONS SYMBOL VCC VI VO Tamb tr, tf PARAMETER supply voltage input voltage output voltage operating ambient temperature input rise and fall times VCC = 1.2 to 2.7 V VCC = 2.7 to 3.6 V output HIGH or LOW state output 3-state CONDITIONS for maximum speed performance for low-voltage applications MIN. 2.7 1.2 0 0 0 -40 0 0
74LVC245A; 74LVCH245A
MAX. 3.6 3.6 5.5 VCC 5.5 +125 20 10 V V V V V
UNIT
C ns/V ns/V
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL VCC IIK VI IOK VO IO ICC, IGND Tstg Ptot Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. For SO20 packages: above 70 C derate linearly with 8 mW/K. For SSOP20 and TSSOP20 packages: above 60 C derate linearly with 5.5 mW/K. For DHVQFN20 packages: above 60 C derate linearly with 4.5 mW/K. PARAMETER supply voltage input diode current input voltage output diode current output voltage output source or sink current VCC or GND current storage temperature power dissipation Tamb = -40 to +125 C; note 2 VI < 0 note 1 VO > VCC or VO < 0 output 3-state; note 1 VO = 0 to VCC CONDITIONS - -0.5 - -0.5 - - -65 - MIN. -0.5 MAX. +6.5 -50 +6.5 50 +6.5 50 100 +150 500 V mA V mA V mA mA C mW UNIT
output HIGH or LOW state; note 1 -0.5
VCC + 0.5 V
2003 May 07
6
Philips Semiconductors
Product specification
Octal bus transceiver with direction pin with 5 V tolerant input/outputs (3-state)
DC CHARACTERISTICS At recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER Tamb = -40 to +85 C VIH VIL VOH HIGH-level input voltage LOW-level input voltage HIGH-level output voltage VI = VIH or VIL IO = -100 A IO = -12 mA IO = -18 mA IO = -24 mA VOL LOW-level output voltage VI = VIH or VIL IO = 100 A IO = 12 mA IO = 24 mA ILI IOZ input leakage current 3-state output OFF-state current power off leakage supply quiescent supply current additional quiescent supply current per pin bus-hold LOW sustaining current bus-hold HIGH sustaining current VI = 5.5 V or GND; note 2 VI = VIH or VIL; VO = 5.5 V or GND; notes 2 and 3 VI or VO = 5.5 V VI = VCC or GND; IO = 0 VI = VCC - 0.6 V; IO = 0 VI = 0.8 V; notes 4, 5 and 6 VI = 2.0 V; notes 4, 5 and 6 2.7 to 3.6 2.7 3.0 3.6 3.6 - - - - - 0 - - 2.7 to 3.6 2.7 3.0 3.0 VCC - 0.2 VCC - 0.5 VCC - 0.6 VCC - 0.8 1.2 2.7 to 3.6 1.2 2.7 to 3.6 VCC 2.0 - - - - - - VCC (V) MIN.
74LVC245A; 74LVCH245A
TYP.(1) MAX.
UNIT
- - 0 0.8 - - - - 0.2 0.4 0.55 5 5
V V V V V V V V V V V A A
VCC - - -
0.1 0.1
Ioff ICC ICC IBH(L) IBH(H) IBH(LO) IBH(HO)
0.0 3.6 2.7 to 3.6 3.0 3.0 3.6 3.6
- - - 75 -75 500 -500
0.1 0.1 5 - - - -
10 10 500 - - - -
A A A A A A A
bus-hold LOW overdrive notes 4, 5 and 7 current bus-hold HIGH overdrive current notes 4, 5 and 7
2003 May 07
7
Philips Semiconductors
Product specification
Octal bus transceiver with direction pin with 5 V tolerant input/outputs (3-state)
TEST CONDITIONS SYMBOL PARAMETER OTHER Tamb = -40 to +125 C VIH VIL VOH HIGH-level input voltage LOW-level input voltage HIGH-level output voltage VI = VIH or VIL IO = -100 A IO = -12 mA IO = -18 mA IO = -24 mA VOL LOW-level output voltage VI = VIH or VIL IO = 100 A IO = 12 mA IO = 24 mA ILI IOZ input leakage current 3-state output OFF-state current power off leakage supply quiescent supply current additional quiescent supply current per in. pin bus-hold LOW sustaining current bus-hold HIGH sustaining current VI = 5.5 V or GND; note 2 VI = VIH or VIL; VO = 5.5 V or GND; notes 2 and 3 VI or VO = 5.5 V VI = VCC or GND; IO = 0 VI = VCC - 0.6 V; IO = 0 2.7 to 3.6 2.7 3.0 3.6 3.6 - - - - - - - - - - 2.7 to 3.6 2.7 3.0 3.0 VCC - 0.3 - 1.2 2.7 to 3.6 1.2 2.7 to 3.6 VCC 2.0 - - - - - - VCC (V) MIN.
74LVC245A; 74LVCH245A
TYP.(1) MAX.
UNIT
- - 0 0.8 - - - - 0.3 0.6 0.8 20 20
V V V V V V V V V V V A A
VCC - 0.65 - VCC - 0.75 - VCC - 1 -
Ioff ICC ICC
0.0 3.6 2.7 to 3.6
- - -
- - -
20 40 5000
A A A
IBH(L) IBH(H) IBH(LO) IBH(HO) Notes
VI = 0.8 V; notes 4, 5 and 6 VI = 2.0 V; notes 4, 5 and 6
3.0 3.0 3.6 3.6
60 -60 500 -500
- - - -
- - - -
A A A A
bus-hold LOW overdrive notes 4, 5 and 7 current bus-hold HIGH overdrive current notes 4, 5 and 7
1. All typical values are measured at VCC = 3.3 V and Tamb = 25 C. 2. For bus-hold parts, the bus-hold circuit is switched off when VI > VCC allowing 5.5 V on the input terminal. 3. For I/O ports the parameter IOZ includes the input leakage current. 4. Valid for data inputs of bus-hold parts (74LVCH245A) only. 5. For data inputs only, control inputs do not have a bus-hold circuit. 6. The specified sustaining current at the data input holds the input below the specified VI level. 7. The specified overdrive current at the data input forces the data input to the opposite logic input state. 2003 May 07 8
Philips Semiconductors
Product specification
Octal bus transceiver with direction pin with 5 V tolerant input/outputs (3-state)
AC CHARACTERISTICS GND = 0 V; tr = tf 2.5 ns. TEST CONDITIONS SYMBOL Tamb = -40 to +85 C tPHL/tPLH propagation delay An to Bn, Bn to An see Figs 5 and 7 1.2 2.7 3.0 to 3.6 tPZH/tPZL 3-state output enable time OE to An, OE to Bn 3-state output disable time OE to An, OE to Bn skew see Figs 6 and 7 1.2 2.7 3.0 to 3.6 tPHZ/tPLZ see Figs 6 and 7 1.2 2.7 3.0 to 3.6 tsk(0) note 2 Tamb = -40 to +125 C tPHL/tPLH propagation delay An to Bn, Bn to An see Figs 5 and 7 1.2 2.7 3.0 to 3.6 tPZH/tPZL 3-state output enable time OE to An, OE to Bn 3-state output disable time OE to An, OE to Bn skew see Figs 6 and 7 1.2 2.7 3.0 to 3.6 tPHZ/tPLZ see Figs 6 and 7 1.2 2.7 3.0 to 3.6 tsk(0) Notes 1. Typical values are measured at VCC = 3.3 V. note 2 - 1.5 1.5 - 1.5 1.5 - 1.5 1.7 - - 1.5 1.5 - 1.5 1.5 - 1.5 1.7 - PARAMETER WAVEFORMS VCC (V) MIN.
74LVC245A; 74LVCH245A
TYP.
MAX.
UNIT
17 3.4 2.9(1) 22 5.0 4.0(1) 12 3.6 3.4(1) - - - - - - - - - - -
- 7.3 6.3 - 9.5 8.5 - 8.0 7.0 1.0 - 9.5 8.0 - 12.0 11.0 - 10.0 9.0 1.5
ns ns ns ns ns ns ns ns ns ns
ns ns ns ns ns ns ns ns ns ns
2. Skew between any two outputs of the same package switching in the same direction. This parameter is guaranteed by design.
2003 May 07
9
Philips Semiconductors
Product specification
Octal bus transceiver with direction pin with 5 V tolerant input/outputs (3-state)
AC WAVEFORMS
74LVC245A; 74LVCH245A
handbook, halfpage VI
An, Bn input GND tPLH VOH Bn, An output VOL
VM
VM
tPHL
VM
VM
MNA176
VM = 1.5 V at VCC 2.7 V. VM = 0.5VCC at VCC < 2.7 V. VOL and VOH are typical output voltage drop that occur with the output load.
Fig.5 The inputs An, Bn to outputs Bn, An propagation delays.
handbook, full pagewidth
VI nOE input GND tPLZ VCC output LOW-to-OFF OFF-to-LOW VOL tPHZ VOH output HIGH-to-OFF OFF-to-HIGH GND outputs enabled VY VM VM VX tPZH tPZL VM
outputs disabled
outputs enabled
MNA362
VM = 1.5 V at VCC 2.7 V; VM = 0.5VCC at VCC < 2.7 V; VX = VOL + 0.3 V at VCC 2.7 V; VX = VOL + 0.1 V at VCC < 2.7 V; VY = VOH - 0.3 V at VCC 2.7 V; VY = VOH - 0.1 V at VCC < 2.7 V.
VOL and VOH are typical output voltage drop that occur with the output load.
Fig.6 3-state enable and disable times.
2003 May 07
10
Philips Semiconductors
Product specification
Octal bus transceiver with direction pin with 5 V tolerant input/outputs (3-state)
74LVC245A; 74LVCH245A
handbook, full pagewidth
S1 VCC PULSE GENERATOR VI D.U.T. RT CL 50 pF RL 500 VO RL 500
2 x VCC open GND
MNA368
SWITCH POSITION TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH SWITCH open 2 x VCC GND
VCC < 2.7 V 2.7 - 3.6 V VCC 2.7 V
VI
Definitions for test circuit: RL = Load resistor. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig.7 Load circuitry for switching times.
2003 May 07
11
Philips Semiconductors
Product specification
Octal bus transceiver with direction pin with 5 V tolerant input/outputs (3-state)
PACKAGE OUTLINES SO20: plastic small outline package; 20 leads; body width 7.5 mm
74LVC245A; 74LVCH245A
SOT163-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 A1 pin 1 index Lp L 1 e bp 10 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.1 A1 0.3 0.1 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 13.0 12.6 0.51 0.49 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.05 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT163-1 REFERENCES IEC 075E04 JEDEC MS-013 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
2003 May 07
12
Philips Semiconductors
Product specification
Octal bus transceiver with direction pin with 5 V tolerant input/outputs (3-state)
74LVC245A; 74LVCH245A
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm
SOT339-1
D
E
A X
c y HE vMA
Z 20 11
Q A2 pin 1 index A1 (A 3) Lp L 1 e bp 10 wM detail X A
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 7.4 7.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 0.9 0.5 8 0o
o
Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION SOT339-1 REFERENCES IEC JEDEC MO-150 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
2003 May 07
13
Philips Semiconductors
Product specification
Octal bus transceiver with direction pin with 5 V tolerant input/outputs (3-state)
74LVC245A; 74LVCH245A
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
D
E
A
X
c y HE vMA
Z
20
11
Q A2 pin 1 index A1 (A 3) A
Lp L
1
e bp
10
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 6.6 6.4 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.5 0.2 8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT360-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19
2003 May 07
14
Philips Semiconductors
Product specification
Octal bus transceiver with direction pin with 5 V tolerant input/outputs (3-state)
74LVC245A; 74LVCH245A
DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; SOT764-1 20 terminals; body 2.5 x 4.5 x 0.85 mm
D
B
A
A A1 E c
terminal 1 index area
detail X
terminal 1 index area e 2 L
e1 b 9 vMCAB wM C y1 C
C y
1 Eh 20
10 e 11
19 Dh 0
12 X 2.5 scale 5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. 1 A1 0.05 0.00 b 0.30 0.18 c 0.2 D (1) 4.6 4.4 Dh 3.15 2.85 E (1) 2.6 2.4 Eh 1.15 0.85 e 0.5 e1 3.5 L 0.5 0.3 v 0.1 w 0.05 y 0.05 y1 0.1
Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION SOT764-1 REFERENCES IEC --JEDEC MO-241 JEITA --EUROPEAN PROJECTION ISSUE DATE 02-10-17 03-01-27
2003 May 07
15
Philips Semiconductors
Product specification
Octal bus transceiver with direction pin with 5 V tolerant input/outputs (3-state)
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferably be kept: * below 220 C for all the BGA packages and packages with a thickness 2.5mm and packages with a thickness <2.5 mm and a volume 350 mm3 so called thick/large packages * below 235 C for packages with a thickness <2.5 mm and a volume <350 mm3 so called small/thin packages. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed.
74LVC245A; 74LVCH245A
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
2003 May 07
16
Philips Semiconductors
Product specification
Octal bus transceiver with direction pin with 5 V tolerant input/outputs (3-state)
Suitability of surface mount IC packages for wave and reflow soldering methods PACKAGE(1) BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP Notes not suitable not suitable(3)
74LVC245A; 74LVCH245A
SOLDERING METHOD WAVE REFLOW(2) suitable suitable suitable suitable suitable
suitable not not recommended(4)(5) recommended(6)
1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2003 May 07
17
Philips Semiconductors
Product specification
Octal bus transceiver with direction pin with 5 V tolerant input/outputs (3-state)
DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION
74LVC245A; 74LVCH245A
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2003 May 07
18
Philips Semiconductors
Product specification
Octal bus transceiver with direction pin with 5 V tolerant input/outputs (3-state)
NOTES
74LVC245A; 74LVCH245A
2003 May 07
19
Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613508/03/pp20
Date of release: 2003
May 07
Document order number:
9397 750 10562

▲Up To Search▲

Price & Availability of 74LVCH245APW

	To Download 74LVCH245APW Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .